bondexpo 2015

The international trade fair for bonding technology will take place in Stuttgart from 5. to 8. Oct. 2015.

Merbenit will be promoted and new interesting products will be released.

Brand partner Reiss GmbH and the merz+benteli team would be pleased to see you on stand 9200 in hall 9.

To get your personal free admission for the Bondexpo 2015 please follow the link and register. Please note that you have the possibility to invite your customers and partners as well by forwarding this link.

About Bondexpo 2015

Bondexpo 2015 is an international trade fair for bonding technology. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.