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Case Study: Smart Ring Manufacturing with Bostik

In this case study, we explore how Bostik Born2Bond Light Lock HV was used to successfully bond smart ring substrates and components by a smart ring manufacturer.

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Smart Ring Manufacturing

Case Study: Smart Ring Manufacturing with Bostik

Since the introduction of the smartwatch, innovative wearable technology has revolutionised data-capturing and personal monitoring. Discrete and fashionable, Smart Rings resemble regular rings, yet they are equipped with sensor technology to include features such as heart rate monitors, accelerometers and gyroscope/temperature sensors. These sensors collect data from the wearer, communicating via Bluetooth or NFC (Near Field Communication) to a smartphone, tablet, or computer. Used for their health tracking and convenience features, Smart Rings contain intricate components that require secure bonding solutions.

The Client

A Smart Ring manufacturer approached us seeking a bonding solution for the connectors and components contained within the frame of the Smart Ring. Adhesive bonding is crucial in the manufacturing process of Smart Rings as it provides component attachment, waterproofing and sealing, vibration dampening, heat dissipation, chemical resistance, and overall reliability. Manufacturers typically conduct rigorous testing to ensure that chosen adhesive bonding meets the specific requirements of a Smart Rings design and intended use. Within the testing stages, the client uncovered several problems relating to their chosen adhesive, prompting an examination of the issues that eventually led to a permanent solution.

The Problem

The client’s existing bonding process using a cyanoacrylate adhesive returned sub-optimal results. Specifically, the bonding process was difficult to automate, slower than required, and didn’t provide sufficient bond strength between the Smart Ring’s substrate and electronic components. These issues posed several critical challenges for the client’s manufacturing operations. The difficulties in automation can lead to inconsistencies in the end product, whereas the lack of adequate bond strength jeopardises long-term durability. Moreover, extended curing times can impede the production’s efficiency and throughput.

The Solution

Bostik representatives worked closely with the manufacturer to conduct research and testing to identify the most suitable adhesive solution. Reviewing results, it was clear that Bostik’s Born2Bond Light Lock HV was the ideal solution for the challenges. Bostik’s Born2Bond™ Light Lock HV is a low-odour, low-bloom, dual-cure cyanoacrylate adhesive, specifically designed for bonding applications requiring fast fixing, coating, or surface curing. Born2Bond™ Light Lock comes in a range of viscosities, including MV (medium viscosity), HV (high viscosity), and GEL (gel viscosity). In this instance, the HV ensures maximum bond strength and performance.

In adopting Bostik’s Born2Bond™ Light Lock HV adhesive, the client resolved all previous bonding challenges whilst improving the overall manufacturing process. With its outstanding bonding properties, dual-cure capabilities, and viscosity options, Born2Bond™ Light Lock HV proved to be the ideal solution for enhancing Smart Ring production, leading to a more efficient and reliable manufacturing process and ensuring the high-quality performance of the final product.

The Benefits

As a result of using Bostik’s Born2Bond™ Light Lock HV, the manufacturer was able to achieve: 

  • Fast and easy curing
  • Dual-cure polymerisation system
  • Good adhesion between ring substrates and electronic components
  • Easy automation

In addition to this application, Bostik’s Born2Bond™ Light Lock HV can also be used for conformal coatings, needle joints, plastic-to-metal bonding, and glass-to-metal bonding. Discover how our Bostik products have also been used in smartwatch manufacturing, bus assembly, vehicle conversions, and electric bikes.

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