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DOWSIL™ TC-2035 CV: Thermally Conductive Adhesive for Automotive Electronic Assembly

Discover the new DOWSIL™ TC-2035 CV adhesive, a high thermally-conductive adhesive for automotive electronic assembly applications.

Table of Contents

Introducing: DOWSIL™ TC-2035 CV Adhesive

The new DOWSIL™ TC-2035 CV adhesive is a high thermally-conductive adhesive capable of low-temperature fast curing and outstanding room-temperature shelf-life stability for automotive electronic assembly applications. This new technology is helping to power the next generation of low-carbon mobility.

This high-performance adhesive offers a combination of exceptional properties including a high thermal conductivity of 3.3 W/m.K for efficient heat transfer, low bond line thickness of ~50% for minimal impact on component dimensions, high elongation at break of ~50% for flexibility and resilience, and easy dispensing for convenient application. DOWSIL™ TC-2035 CV also offers rapid bonding through temperature curing at 115°C/15 minutes, primerless adhesion (on selected substrates) for simplified assembly, a long shelf life of 12 at or below 35°C for extended storage, and low volatile content of <100 ppm ensuring environmental safety.
DOWSIL TC-2035 excels in diverse automotive applications, including;

  • ADAS (Advanced Driver Assistance Systems)
  • ECU Assembly
  • Power electronics
    • Converter/inverter 
    • OBC

Comparing DOWSIL™ TC-2035 CV with DOWSIL™ TC-2035:

Property DOWSIL™

TC-2035 CV Adhesive

DOWSIL™

TC-2035 Adhesive

Benefits
Color Reddish brown Reddish brown
Thermal conductivity (W/mK) 3.3 3.0 High thermal conductivity
Specific gravity – cured 3.00 03.07
Initial extrusion rate (g/min) Part A: 33

Part B: 52

Part A: 43

Part B: 58

High dispense rate – higher throughput
Shelf life (months) 12 6 Lower scrap
Storage condition ≤ 35°C ≤ 25°C Lower scrap and energy consumption
Pot life (hour) 3.5 5 Easier processing
Durometer (Shore D) 33 38
Tensile strength (MPa) 3.7 3.1 Higher reliability
Elongation (%) 50 55 Flexible joints, less material needed
Adhesion failure mode (%) ≥90% Cohesive

*Al – A5052P, Anodized

≥90% Cohesive

*Al – A1050P

Good primerless adhesion
Lap shear adhesion (MPa) 2.9; *Al – A5052P, Anodized 2.6; *Al – A1050P Stronger adhesion
Cure condition 15 minutes at 115°C 30 minutes at 125°C Faster processing,

lower energy consumption

DOWSIL™ TC-2035 CV Adhesive:

Table 1

Test Property
CTM1 0176 B Two-part
CTM1 0176 B Colour:
Part A – WhitePart B – Reddish-brown
CTM 0022 B Density: Part A and Part B – 3.0g/cm3 
Mix ratio – 1:1
Heat cure time at 115°C – 15 minutes

Table 2

Test Property Result
CTM 1094 C Viscosity at 1 (1/s)

Part A

Part B

350 Pa.s

290 Pa.s

CTM 1094 N Viscosity at 1 (1/s) mixed 345 Pa.s
CTM 1393 Minimum bond line thickness ≤ 95 μm
CTM 0137 Tensile strength 3.7 MPa
CTM 0137 Elongation 50%
CTM 0243 A Adhesion –

Lap shear; Al anodised A5052P

Failure mode–cohesive

2.9 MPa

≥ 90%

CTM 0114 Dielectric strength at 1 mm 22 kV/mm
CTM 1163 Thermal conductivity by transient method 3.3 W/mK
DIN2 51007 Heat capacity, volumetric at 25°C

Heat capacity at 25°C

2.63 MJ/m3K

0.88 J/gK

ASTM3 E 831 Linear CTE (by TMA -50 to 200°C) 93.6 ppm/K

Properties of DOWSIL™ TC-2035 CV Adhesive: 

Thermal and electrical properties

  • Thermal conductivity: 3.3 W/mK
  • Dielectric strength: 22 kV/mm
  • Heat capacity at 25°C: 0.88 J/gK
  • Linear CTE (-50 to 200°C): 93.6 ppm/K

Primerless adhesion on select substrates

DOWSIL™ TC-2035 CV Adhesive achieves cohesive failure on most common aluminium substrates without the use of any primer.  

DOWSIL™ TC-2035 CV

Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion

Silicone curing mechanism 

Additional-cure material

  • Low cure initiation temperature with onset between 74.6 and 77.2°C and peak at 77.9 to 80.6°C
  • No cure by-products
  • Minimal shrinkage

Addition-cure material

Pot life and curing profile

Pot life profile
Initial 120

minutes

180

minutes

210

minutes

240 minutes
1 (1/s)

Pa-s

323 372 460 566 741
Viscosity change 15% 42% 75% 130%

Curing profile

Stable viscosity

  • Viscosity of DOWSIL™ TC-2035 CV Adhesive remains completely stable throughout its shelf life
  • Almost non-existent sedimentation or separation

Aging; top and bottom of pail

High purity material

Total D4-D6 content below 100 ppm
(Unit: µg/g) D4 D5 D6
Batch 1 18.90 5.40 2.40
Batch 2 20.20 5.50 2.50
Average 19.50 5.45 2.45
Ionic species below 5 ppm
Element DOWSIL™

TC-2035 CV Adhesive (1)

DOWSIL™

TC-2035 CV Adhesive (2)

DOWSIL™

TC-2035 CV Adhesive (3)

Cation measurement results
Sodium <2.64 <2.64 <2.64
Potassium <1.13 <1.13 <1.13
Anion measurement results
Fluorine <0.32 <0.32 <0.32
Chlorine <3.33 <3.33 <3.33
Bromine <0.58 <0.58 <0.58

Processing

  • Minimum BLT ≤ 95 µm
  • Mixing ratio 1:1 
  • Cure profile 15 minutes at 115°C
  • Pot life 3 to 4 hours at 25°C
  • Fast dispensing
    • Extrusion rate Part A: 33 g/min
    • Extrusion rate Part B: 52 g/min

Mixing ratio tolerance

Properties Range Initial

mixing ratio

A/B=100/100

Initial

mixing ratio

A/B=115/100

Initial

mixing ratio

A/B=100/115

Viscosity of mixture 1700 ± 500 Pa·s 1734 1629 1555
330 Pa·s ± 150 Pa·s 348 338 332
150 +- 40 Pa·s 152 151 150
Change of viscosity (2 hr) under 20% increase 3 7 3
Thermal conductivity 3.4 W/mK +/- 0.3 W/mK 3.4 3.3 3.3
Tensile strength 2.9 MPa -0.7/+ 1.5 MPa 3.6 3.1 3.8
Tensile properties

elongation at break

55% – 10 /+ 25% 47 56 49
Linear strain limit 5% +- 0.5% 5.2 5.0 5.0
Curing parameters
Specific density 3.00 +/- 0.1 g/cm³ 2.99 2.99 2.99
Shore hardness 28 +/- 10 Shore D 38 33 37
Tensile lap shear strength A5052P

2.3 N/mm² – 0.5 /+ 0.9 N/mm²

03.04 2.56 3.15

DOWSIL™ TC-2035 CV Adhesive Overview

For more information regarding DOWSIL™ TC-2035 CV, visit the product page, or contact our technical experts.

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