Merbenit at Bondexpo 2018

Bondexpo 2018

Merz + benteli will be exhibiting the Merbenit range of products at the international trade fair, Bondexpo 2018. This year’s event takes place in Stuttgart from the 8th October to 11th October 2018.

Merbenit SMP Adhesives and Sealants

The Merbenit range of innovative and environmentally friendly adhesives and sealants have enabled customers to optimise and reduce manufacturing costs.

Merbenit E20

Lightweight sealant with a density of 0.7g/m3, provides savings of 40% in weight compared to standard seam sealants.

Merbenit 2K10

Fast adhesive with quick strength build-up and a typical handling strength of 60 minutes.

Merbenit IA45

High strength, correctable contact adhesive with good working time, self-levelling and remains permanently flexible.

Visitors will have the opportunity to find out more about the Merbenit range of bonding solutions at the trade fair.

Visit Merbenit at Stand 6300, Hall 6

Merbenit at Bondexpo 2018

Bondexpo

Bondexpo is a global trade fair for bonding technology.

The event focuses on the assembling and joining process chain and showcases bonding solutions that simplify the assembly of components made of CFRP materials and plastics – bonding, sealing, insulation, foaming and dosing for parts production and the assembly of modules and complete devices.

To register for the event, click here

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