Born2Bond Light Lock MV – Low Odour, Low Bloom, Dual-Cure Cyanoacrylate Adhesive

Born2Bond Light Lock MV is a low odour, low bloom, dual-cure cyanoacrylate adhesive. Its viscosity is medium.

Born2Bond Light Lock MV – Low Odour, Low Bloom, Dual-Cure Cyanoacrylate Adhesive

Born2Bond Light Lock MV is a low odour, low bloom, dual-cure cyanoacrylate adhesive.

Description

Born2Bond Light Lock MV is a proprietary low odour, low bloom, dual-cure (contact and light cure) cyanoacrylate adhesive. It is designed for bonding applications that require fast fixing, coating or surface curing. UV and visible light cure sensitivity allow for fast bonding through transparent parts and fast cure of light-exposed coated areas. In addition, the product’s instant bonding ability ensures cure between opaque substrates (contact cure).

Features Born2Bond Light Lock MV

Below these lines we present the main characteristics of the product:

  • Dual cure formulation: instant and light cure
  • Fixation time in 60 seconds without exposure to light and 5 seconds with light-curing
  • Can be cured with visible light and UV-LED
  • Long open time without activation
  • Touch dry, tack-free surface cure
  • On-demand curing of excess material released from bond lines
  • Adheres, fills, rebuilds and covers
  • Low odour, low bloom.
  • Available in a range of viscosities: MV, HV and GEL.

Born2Bond Light Lock MV Specifications

This Bostik product has the following advantages:

  • Base technology: Light-curing methoxyethyl cyanoacrylate
  • Colour: Transparent after curing
  • Viscosity: 180 – 220
  • Bond strength: Shot blasting, hardened steel, 2 MPa
  • Fixation time: 5 seconds
  • Use temperature range: -40°C to 80°C

Product Applications

Typical applications for this product are conformal coating, encapsulation, needle bonding, perfume and liquor bottle metal bonding, electronics assembly, plastic-to-metal bonding for hearing aids, and glass-to-metal bonding for jewellery and watches.

Limitations

It should be noted that this product is not recommended for use in pure oxygen and/or oxygen rich systems.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts