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DOWSIL™ 3-6752 Thermally Conductive Adhesive

Thixotropic thermally conductive adhesive with good flame resistance.

DOWSIL™ 3-6752 Thermally Conductive Adhesive

Features of DOWSIL™ 3-6752 Thermally Conductive Adhesive

  • Thixotropic – increased flowability under shear/dispense
  • Heat cure
  • Outstanding thermal conductivity values
  • UL V-0 recognized
  • No added solvents
  • One part – no mixing of separate components required
  • Rapid, versatile cure processing controlled by temperature
  • Able to flow, fill or self leveling after dispensing
  • Provides heat flow away from circuitry components can increase reliability
  • Can be considered for uses requiring added flame resistance

Applications

DOWSIL™ 3-6752 Thermally Conductive Adhesive typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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