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DOWSIL™ TC-5026 Thermally Conductive Compound

Grey, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5026 Thermally Conductive Compound

Features of DOWSIL™ TC-5026 Thermally Conductive Compound

  • Solventless formulation
  • Flowable
  • Non-curing – no need for curing ovens
  • Capable of achieving thin Bond Line Thickness for optimum performance
  • Very low thermal resistance
  • High thermal conductivity
  • Conducts heat away from sensitive components


DOWSIL™ TC-5026 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.

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