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Dowsil ee-3200

DOWSIL™ TC-5550 Thermal Conductive Compound

Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications.

DOWSIL™ TC-5550 Thermal Conductive Compound

Features of DOWSIL™ TC-5550 Thermal Conductive Compound

  • Good pump-out resistance for bare die application
  • High thixotropy
  • One part material
  • Solvent free formulation
  • Easy application – screen and stencil printable
  • High thermal conductivity
  • Achieves thin bond line thickness (BLT)
  • Low thermal resistance

Applications

  • DOWSIL™ TC-5550 Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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