Araldite 2014-1 is a two component, room temperature curing, thixotropic, epoxy adhesive. The Araldite 2014-1 is suitable for bonding metals, electronic components, GRP structures and other materials where the temperature is higher than normal in an aggressive environment.
Araldite 2014-1 is a gap filling, room temperature curing adhesive, producing very little out gassing when curing, making it ideal for specialised electronics, telecommunication and aerospace applications.
With a high temperature resistance to 120°C and excellent resistance to water and chemicals, the adhesive provides a good bond to a wide variety of substrates.
Huntsman Araldite 2000 Range
This product is part of the Huntsman Araldite 2000 range of Epoxy, Polyurethane and Methacryate (MMA) designed to bond a wide range of materials including metals, composites and thermoplastics. For other products within the Araldite 2000 range, please click here.