Permabond ES560 1K heat-cure Epoxy for electronics

Permabond ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and self-levelling, making it particularly suitable for electronics.

Permabond ES560 1K heat-cure Epoxy for electronics - Description

Permabond ES560 is a single-part epoxy adhesive particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.


Applications

  • Ideal for electronics potting and encapsulation applications, as well as underfilling and reworking microchips

Features

  • Excellent adhesive strength
  • Excellent resistance to vibration
  • Easy to use – no mixing required
  • Low viscosity

For pack sizes, please see Additional Information. 


Surface Preparation

  • Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces.
  • Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.

Video


Directions for Use

  1. The adhesive should be dispensed from the cartridge via the nozzle supplied (this can be cut to give the appropriate sized bead to cover the bond area).
  2. Apply the adhesive to one surface and avoid entrapping air.
  3. Assemble parts applying sufficient pressure to ensure the adhesive spreads to cover the entire bond area.
  4. Use a jig / clamp to prevent parts moving during cure.
  5. It is advisable not to disturb the joint until the adhesive is fully cured.
  6. Cure with heat – see page one for cure schedule

Single-part epoxy directions for use video

This product is part of the Permabond range

TDS / MSDS

To request any type of technical sheet or safety sheet.