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Dowsil

SYLGARD™ 567 Primerless Silicone Encapsulant

Two-part, heat cure, 1 to 1 mix, black encapsulant with good flame resistance.

SYLGARD™ 567 Primerless Silicone Encapsulant

Features of SYLGARD™ 567 Primerless Silicone Encapsulant

  • 1 to 1 mix ratio
  • Flowable
  • Self-priming
  • UL 94 V-0 Recognised
  • No additional priming step required
  • Rapid, versatile cure processing controlled by temperature
  • Low viscosity enhances flow and fill in narrow spaces and around complex geometries
  • Good dielectric properties

Applications

  • General potting applications in applications like power supplies, automotive assembly, LED lighting, connectors, industrial controls, amplifiers, relays and high voltage resistor packs
  • Encapsulant for solar cells

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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