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Dowsil 736

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

Silicone gap filler material for automotive components; a two-part material curing at room temperature with controlled silicone volatility

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

Features & Benefits of DOWSIL™ TC-4525 CV

  • Thermal conductivity: > 2.5 W/m-K
  • Room temperature cure
  • Long term performance stability during temperature cycling up to 150°C
  • Low compression stress
  • Holds vertical position (cured or uncured state)
  • Controlled silicone volatility

Composition

  • Silicone gel matrix for long term reliability
  • Treated alumina to enhance thermal conductivity while managing the stability of bulk properties
  • Platinum cure system for a fast controlled cure

Applications

  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
  • This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.

Please be advised

As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual. 

We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers. 

Please contact us via phone, website or email 

We wish you the best during this difficult period.