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Dowsil 736

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

Silicone gap filler material for automotive components; a two-part material curing at room temperature with controlled silicone volatility

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

Features & Benefits of DOWSIL™ TC-4525 CV

  • Thermal conductivity: > 2.5 W/m-K
  • Room temperature cure
  • Long term performance stability during temperature cycling up to 150°C
  • Low compression stress
  • Holds vertical position (cured or uncured state)
  • Controlled silicone volatility

Composition

  • Silicone gel matrix for long term reliability
  • Treated alumina to enhance thermal conductivity while managing the stability of bulk properties
  • Platinum cure system for a fast controlled cure

Applications

  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
  • This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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