Dowsil 736

DOWSIL™ 1-4173 Thermally Conductive Adhesive

DOWSIL™ 1-4173 Thermally Conductive Adhesive is a one-part grey, flowable thermally conductive adhesive with high tensile strength.

DOWSIL™ 1-4173 Thermally Conductive Adhesive

Features & Benefits of DOWSIL™ 1-4173

  • Flowable
  • Heat cure
  • Good thermal conductivity values
  • No added solvents
  • No mixing of separate components required
  • Rapid, versatile cure processing controlled by temperature
  • Able to flow, fill or self-levelling after dispensing
  • Heat flow away from PCB systems components can increase reliability


  • Polydimethylsiloxane
  • Aluminum Oxide


  • Bonding integrated circuit substrates
  • Adhering lids and housings
  • Base plate attach
  • Heat sink attach, automated or manual dispensing

Please be advised

As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual. 

We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers. 

Please contact us via phone, website or email 

We wish you the best during this difficult period.