DOWSIL™ 3-6752 Thermally Conductive Adhesive

Thixotropic thermally conductive adhesive with good flame resistance.

DOWSIL™ 3-6752 Thermally Conductive Adhesive

Features of DOWSIL™ 3-6752 Thermally Conductive Adhesive

Thixotropic – increased flowability under shear/dispense
Heat cure
Outstanding thermal conductivity values
UL V-0 recognized
No added solvents
One part – no mixing of separate components required
Rapid, versatile cure processing controlled by temperature
Able to flow, fill or self leveling after dispensing
Provides heat flow away from circuitry components can increase reliability
Can be considered for uses requiring added flame resistance

Applications

DOWSIL™ 3-6752 Thermally Conductive Adhesive typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications.

Categories Adhesives and Sealants, Silicone Adhesives Brands: DOWSIL - Dow Corning.

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