DOWSIL™ 3-6752 Thermally Conductive Adhesive

Thixotropic thermally conductive adhesive with good flame resistance.

DOWSIL™ 3-6752 Thermally Conductive Adhesive

Features of DOWSIL™ 3-6752 Thermally Conductive Adhesive

  • Thixotropic – increased flowability under shear/dispense
  • Heat cure
  • Outstanding thermal conductivity values
  • UL V-0 recognized
  • No added solvents
  • One part – no mixing of separate components required
  • Rapid, versatile cure processing controlled by temperature
  • Able to flow, fill or self leveling after dispensing
  • Provides heat flow away from circuitry components can increase reliability
  • Can be considered for uses requiring added flame resistance


DOWSIL™ 3-6752 Thermally Conductive Adhesive typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications.

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts