DOWSIL™ 3-6752 Thermally Conductive Adhesive

Features of DOWSIL™ 3-6752 Thermally Conductive Adhesive

• Thixotropic – increased flowability under shear/dispense
• Heat cure
• Outstanding thermal conductivity values
• UL V-0 recognized
• No added solvents
• One part – no mixing of separate components required
• Rapid, versatile cure processing controlled by temperature
• Able to flow, fill or self leveling after dispensing
• Provides heat flow away from circuitry components can increase reliability
• Can be considered for uses requiring added flame resistance

Applications

DOWSIL™ 3-6752 Thermally Conductive Adhesive typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications.