Dowsil

DOWSIL™ TC-5026 Thermally Conductive Compound

Grey, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5026 Thermally Conductive Compound

Features of DOWSIL™ TC-5026 Thermally Conductive Compound

  • Solventless formulation
  • Flowable
  • Non-curing – no need for curing ovens
  • Capable of achieving thin Bond Line Thickness for optimum performance
  • Very low thermal resistance
  • High thermal conductivity
  • Conducts heat away from sensitive components

Applications

DOWSIL™ TC-5026 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, notebooks, and game consoles.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts