General Description

The DOWSIL 3-6635 is a singular, highly efficient heat-curing dielectric gel. This innovative product is specifically designed for encapsulating and safeguarding electronic components against extreme environments, moisture, and stress. Its unique characteristics, such as low temperature stability and high flowability, enable it to offer superior protection and performance. In addition, the self-healing properties of DOWSIL 3-6635 make it ideal for use in extreme conditions.

Product Properties

The DOWSIL 3-6635 comes with a range of impressive technical specifications:

• Type: A one-part, heat-curing dielectric gel which requires no mixing.
• Temperature Range: The product can withstand temperatures from -80°C to 200°C (-112°F to 392°F).
• Viscosity: Falls within the range of 700 to 1,100, offering superior flowability.
• Dielectric Strength: Stands at an impressive 520 V/mil.
• Flash Point: More than 111.1°C, ensuring safe usage.
• Specific Gravity: 0.987 @ 25°C, which is indicative of its lightweight nature.
• Volume Resistivity: Achieving 4.8e + 13 ohm-cm.
• Cure Time: The product fully cures in 50 minutes at 125°C.
• Colour: The clear gel is aesthetically neutral and won’t alter the look of your components.
• Durometer / Hardness: This extreme stress relief gel has a hardness of less than 150 grams.
• Viscosity / Flow: High flow, measured between 500 to 3000 cps.

Product Applications

The DOWSIL 3-6635 Dielectric Gel exhibits utility in a wide range of applications. Specifically, it is instrumental in sealing and protecting electronic devices, especially those with delicate components exposed to low temperatures. Given its excellent properties, it is ideal for encapsulating and potting various electronic components. This includes those utilized in Insulated Gate Bipolar Transistor (IGBT) applications. The product’s remarkable features and versatile uses underscore its value and superior performance in protecting electronics.