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DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Two-part, 1 to 1 grey silicone elastomer, heat cure for manufacturing flexibility, thermally conductive encapsulant/pottant for PCB system assemblies, providing protection from different environmental conditions and thermal management.

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Features & Benefits of DOWSIL™ TC-4605 HLV

  • Heat cure 1 hour at 120°C
  • 1 W/m∙K thermal conductivity
  • Excellent dielectric properties
  • Low viscosity
  • Repairable
  • UL 94 V0 at 1.5 mm thickness
  • Thermal management
  • Mechanical protection
  • Hard elastomer after cure

Composition

  • Two-part silicone elastomer supplied as a flowable liquid
  • 1 to 1 mix ratio by weight

Applications

  • LC module
  • Electric motor
  • Onboard charger
  • Transformer
  • PCB system assembly control unit
  • Automotive applications
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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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