DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Two-part, 1 to 1 grey silicone elastomer, heat cure for manufacturing flexibility, thermally conductive encapsulant/pottant for PCB system assemblies, providing protection from different environmental conditions and thermal management.

DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant

Features & Benefits of DOWSIL™ TC-4605 HLV

  • Heat cure 1 hour at 120°C
  • 1 W/m∙K thermal conductivity
  • Excellent dielectric properties
  • Low viscosity
  • Repairable
  • UL 94 V0 at 1.5 mm thickness
  • Thermal management
  • Mechanical protection
  • Hard elastomer after cure

Composition

  • Two-part silicone elastomer supplied as a flowable liquid
  • 1 to 1 mix ratio by weight

Applications

  • LC module
  • Electric motor
  • Onboard charger
  • Transformer
  • PCB system assembly control unit
  • Automotive applications

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts