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DOWSIL™ TC-5021 Thermally Conductive Compound

Grey, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5021 Thermally Conductive Compound

Features & Benefits of DOWSIL™ TC-5021

  • Flowable
  • Non-curing material – no need for curing ovens
  • Capable of achieving thin Bond Line Thickness
  • Low thermal resistance
  • High thermal conductivity
  • Conducts heat away from sensitive PCB system assembly components

Composition

  • Thermally conductive filler
  • Polydimethylsiloxane matrix

Applications

DOWSIL™ TC-5021 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, and notebooks.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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