DOWSIL™ TC-6020 Thermally Conductive Encapsulant

Two-part, 1 to 1 grey silicone elastomer. Heat cure and room temperature cure for manufacturing flexibility, thermally conductive encapsulant/pottant for PCB system assemblies providing protection from harsh environmental conditions and thermal management.

DOWSIL™ TC-6020 Thermally Conductive Encapsulant

Features & Benefits of DOWSIL™ TC-6020

  • Adhesion to aluminium (Al)
  • High thermal conductivity 2.7 W/m*K
  • Excellent dielectric properties
  • Good flowability, easy dispensing

Composition

  • Two-part silicone elastomer supplier as a flowable liquid
  • 1 to 1 mix ratio by weight

Applications

DOWSIL™ TC-6020 Thermally Conductive Encapsulant is suitable for:

  • Industry power module
  • Automotive control unit

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts