Dowsil

DOWSIL™ EI-1184 Optical Encapsulant

A 1:1 mix ratio, fast curing, 2-part silicone encapsulant suitable for encapsulating rigid and flexible circuit boards indoor and outdoor LED Lighting applications.

DOWSIL™ EI-1184 Optical Encapsulant

Features & Benefits

  • High transparency for improved efficiency
  • Reduced yellowing for longer device lifetime
  • Meets industry standards – UL 94, UL 746C (f1), RTI 150°C
  • 1:1 mix ratio for improved manufacturability
  • Room temperature and heat cure
  • Rapid, versatile cure processing controlled by temperature

Composition

  • Two-part
  • 1 to 1 mix ratio
  • Polydimethylsiloxane elastomer

Applications

DOWSIL™ EI-1184 Optical Encapsulant is suitable for:

    • Encapsulating rigid and flexible circuit boards indoor and outdoor LED Lighting applications.

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts