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MG Chemicals 832TC – Conductive Thermal Epoxy

MG Chemicals 832TC – Thermally Cond. Epoxy Potting & Encapsulating Compound

Explore the superior performance of MG Chemicals 832TC – a thermally conductive epoxy encapsulation and sealing compound. Designed for ultimate thermal management, this product reduces the risk of heat build-up, safeguarding your circuits and electronic assemblies. With an impressive thermal conductivity of 0.68 W/(m.K), high compressive and tensile strength, and excellent adhesion to multiple substrates, this epoxy is a standout in its category. Furthermore, its solvent-free formula and extreme resistance to water and humidity make it an ideal choice for various industrial applications. Experience uncompromised quality and innovation with MG Chemicals 832TC. Upgrade your industrial processes today!

MG Chemicals 832TC – Thermally Cond. Epoxy Potting & Encapsulating Compound

Description

The MG Chemicals 832TC is a high-quality, two-part, thermally conductive epoxy designed specifically for the encapsulation and sealing of printed circuit boards and electronic assemblies. It is distinguished by its black colour and its exceptional environmental, mechanical, and physical protection properties. This epoxy is typically used in circumstances where thermal management is a key concern.

Properties

The 832TC epoxy possesses remarkable properties that make it a reliable choice for protecting and sealing electronic components. Some of its standout properties include:

  • Thermal Conductivity: With a thermal conductivity of 0.68 W/(m.K), this epoxy efficiently facilitates the transfer of thermal energy, thereby reducing the risk of heat build-up that may damage delicate electronic components.
  • Excellent Electrical Insulation: Apart from its heat management capabilities, the epoxy also serves as an excellent electrical insulator, thus ensuring that your electronic components are well-protected against static discharge.
  • Ruggedness and Resilience: The epoxy offers high compressive and tensile strength, ensuring optimal mechanical protection for your electronic components from vibration and abrasion.
  • Wide Adhesion: It adheres excellently to a wide range of substrates including metals, composites, glass, ceramics, and various kinds of plastics.
  • Environmental Resistance: This epoxy is especially resistant to water and humidity, allowing your components to be safely submerged when necessary. In addition, it is also resistant to many harsh chemicals and fungal growth.

Applications

The MG Chemicals 832TC epoxy is designed for use across a wide range of applications, primarily due to its versatility and superior qualities. Its simple 1:1 volume mix ratio makes it compatible with most dispensing equipment, and it can be cured at room temperature or higher. This makes it an ideal choice for:

  • Encapsulation and sealing of printed circuit boards
  • General electronic assembly sealing
  • Thermal management in electronic devices
  • Protection of components from harsh environmental conditions

With its exceptional qualities, the MG Chemicals 832TC is indeed a versatile and reliable solution for your electronic assembly needs. Its thermal conductivity, coupled with its electrical insulation, high strength, and excellent adhesive properties ensure that your electronic components are well-protected and perform optimally even in the harshest conditions.

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