Permabond ES560 is a single-part epoxy adhesive particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.
For pack sizes, please see Additional Information.
This product is part of the Permabond range
As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual.
We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers.
Please contact us via phone, website or email.
We wish you the best during this difficult period.