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Adhesivo MG Chemicals 8329HTC Epoxy Thermal Conductive

MG Chemicals 8329HTC – Thermally Conductive Structural Epoxy Adhesive

Experience the power of MG Chemicals 8329HTC – Thermoconductive Structural Epoxy Adhesive. With its high thermal conductivity and superior bonding strength, this 2-part epoxy adhesive offers robust performance in harsh conditions. It’s a go-to solution for your industrial needs, providing high dimensional stability and resistant to humidity, salt water, chemicals, and corrosive gas. Choose MG Chemicals 8329HTC for a high-performance adhesive that works as hard as you do. Explore our range today and discover the difference quality makes.

MG Chemicals 8329HTC – Thermally Conductive Structural Epoxy Adhesive

The MG Chemicals 8329HTC is a thermoconductive structural epoxy adhesive designed for a wide range of applications that require superior bonding strength, high thermal conductivity, and durability in harsh environments. This 2-part epoxy adhesive stands out due to its high dimensional stability and ability to work in a wide operating temperature range. The adhesive is a thixotropic paste, allowing for localised application even in tight spaces.

Properties

  • High Thermal Conductivity: With a thermal conductivity of 0.9 W/(m·K), this adhesive efficiently transfers heat, making it an ideal choice for applications involving heat-sensitive components.
  • Superior Bonding Strength: The 8329HTC epoxy adhesive possesses impressive tensile, compressive, and lap shear strength, ensuring a robust and lasting bond.
  • Low Coefficient of Thermal Expansion: This property enhances the dimensional stability of the adhesive, allowing it to maintain its structure and integrity even under varying temperature conditions.
  • High Resistance: The cured epoxy is tough, rigid, and highly resistant to physical impacts, shocks, vibration, humidity, salt water, chemicals, and corrosive gases.
  • Room Temperature Curing: The adhesive cures in 24 hours at room temperature, and this curing process can be accelerated with heat.

Applications

The MG Chemicals 8329HTC adhesive is versatile and can bond strongly to a variety of materials such as metal, plastic, glass and wood. It is appropriate for use across a wide range of industries with varying application needs.

  1. Electronic Manufacturing: Due to its high thermal conductivity and superior bonding strength, it is suitable for bonding heat-sensitive components.
  2. Automotive and Aerospace Industry: Given its high resistance to harsh environments and ability to withstand temperature variations, it is highly valuable in the automotive and aerospace industries.
  3. Marine Applications: Its strong resistance to humidity and salt water makes it ideal for marine applications.
  4. General Purpose Bonding: Its ability to bond effectively to different materials like metal, plastic, glass and wood makes it a go-to choice for general purpose bonding.

For different use cases, MG Chemicals also offers alternatives such as 8329TFF and 8349TFM for shorter working times and flame retardancy. For a longer working time and low outgassing, use 8329TCS. Additionally, 9460TC is a 1-part option that offers fast curing and convenience.

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