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The MG Chemicals 832HDA - Encapsulation and Filling Epoxy Compound 1:1

MG Chemicals 832HDA – 1:1 Epoxy Potting & Encapsulating Compound

Experience the superior protection of MG Chemicals 832HDA – Compuesto de Encapsulación y Relleno de Epoxy 1:1. This is a robust, two-component epoxy encapsulation compound designed to offer your electronic assemblies and circuit boards extreme environmental, mechanical and physical protection. Its unique, low mixed-viscosity feature ensures it permeates easily into small gaps and cavities, providing exceptional electrical insulation and protecting components from static discharge and other aggressive conditions. The perfect blend for your equipment, with a 1:1 volume mixing ratio and a wide service temperature range. Choose MG Chemicals 832HDA for enhanced efficiency, durability and performance. Get in touch today to explore how we can tailor our solutions to your specific needs. Trust us for quality, innovation and customer satisfaction.

MG Chemicals 832HDA – 1:1 Epoxy Potting & Encapsulating Compound

The MG Chemicals 832HDA – Encapsulation and Filling Epoxy Compound 1:1 is a powerful, two-component encapsulation compound designed to offer superior environmental, mechanical, and physical protection for printed circuit boards and electronic assemblies. This epoxy compound is designed to be hard and general-purpose, making it suitable for a wide range of applications.

Properties

This encapsulation compound boasts of several impressive properties. Firstly, it’s notable for its low mixed viscosity, allowing it to easily penetrate small gaps and cavities. This ensures even and robust protection for your electronic components.

Secondly, it offers excellent electrical insulation and can protect components from static discharges, vibrations, abrasion, thermal shocks, environmental humidity, saltwater, fungi, and many aggressive chemicals. This makes it a reliable choice for projects that require the utmost resilience.

Further, the MG Chemicals 832HDA compound has an extremely high compression and tensile strength, offering unparalleled structural integrity. It also adheres excellently to substrates such as metals, composites, glass, ceramics, and plastics.

This epoxy compound has a convenient 1A:1B volume mix ratio, making it compatible with most dispensing equipment. It can cure at room temperature or higher, providing considerable flexibility during application.

Finally, it operates in a wide temperature range of -40 to 140°C (-40 to 284°F), and it has extreme resistance to water and moisture. This means it can even be used in situations requiring immersion. As a solvent-free solution, it is also safe and environmentally friendly.

Applications

Due to its robust properties, the MG Chemicals 832HDA compound has a wide range of applications. It is ideally suited for encapsulating and protecting printed circuit boards and electronic assemblies. Thanks to its excellent adhesion to various substrates, this compound is useful in industrial environments and can be applied to metals, composites, glass, ceramics, and plastics.

Its superior electrical insulation makes it perfect for protecting sensitive components from static discharges and other electrical threats. Given its high resistance to water, humidity, and aggressive chemicals, this compound can also be used in challenging environmental conditions, including outdoor applications, marine environments, or in the presence of corrosive substances.

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