Search
Close this search box.
MG Chemicals 834HTC - High Thermal Conductivity Epoxy Encapsulating & Potting Compound

MG Chemicals 834HTC – High Thermal Conductivity Epoxy Encapsulating & Potting Compound

Experience superior electronic protection with MG Chemicals 834HTC – High Thermal Conductivity Encapsulation and Filling Compound. This 2-part, black, rigid epoxy offers unrivalled thermal management with a certified UL 746A flame-retardant feature. Its high thermal conductivity of 0.94 W/(m.K) ensures your circuits and electronic assemblies remain secure against extreme environmental and physical threats. Unique for its low shrinkage and high dimensional stability, the 834HTC epoxy potting is your go-to solution for excellent adhesion to a wide variety of substrates. Discover the benefits of this solvent-free epoxy compound today and elevate your industrial processes to new heights.

MG Chemicals 834HTC – High Thermal Conductivity Epoxy Encapsulating & Potting Compound

Overview

The MG Chemicals 834HTC is an exemplary encapsulating and potting epoxy compound that is specially designed to offer superior thermal conductivity. It is a two-part compound, presenting a rigid and black composition. This epoxy is well renowned for providing exceptional environmental, mechanical, and physical security to printed circuit boards and electronic assemblies.

Key Features and Properties

One of the remarkable attributes of the 834HTC is its flame-retardant quality, which is UL 746A certified. This makes it a reliable choice for applications where thermal management and self-extinguishing capabilities are critical. Additionally, it delivers excellent electrical insulation and guards components from static discharge, vibration, abrasion, thermal shock, and environmental humidity.

Further, this compound is capable of protecting your electronic assemblies from adverse conditions such as salt water, fungus, and many harsh chemicals. It carries a thermal conductivity of 0.94 W/(m.K) and features a low coefficient of thermal expansion (CTE). It also has a low exotherm, implying that it produces minimal heat during the curing process.

What sets the 834HTC apart is its outstanding compressive and tensile strength. It adheres excellently to a wide range of substrates, including metals, composites, glass, ceramics, and many plastics. It is characterised by high dimensional stability and low shrinkage.

  • Service Temperature Range: This epoxy compound can be used across a broad temperature range, from as low as -50°C (-58°F) to as high as 150°C (302°F).
  • Mix Ratio: The 834HTC has a convenient 5A:1B volume mix ratio.
  • Flame-Retardant Fillers: It contains non-halogenated flame-retardant fillers, making it safe and eco-friendly.
  • Solvent-Free: The compound does not contain any solvents, reducing the risk of health hazards and making it user-friendly.

Applications

The 834HTC epoxy compound finds its use in a multitude of applications. Being our best thermally conductive epoxy potting, it can be cured at room temperature or higher, making it highly versatile. It serves as an ideal solution for encapsulating or potting high power electronics and LEDs, transformers, power supplies, sensors, capacitors, and many more electronic gadgets. With its superior properties and features, it is well-equipped to offer unparalleled protection and performance to your electronic assemblies.

Get in touch with Antala

The personal data voluntarily provided by you, through this web form will be treated by ANTALA LTD. as responsible for the treatment, in order to meet your request, query, complaint or suggestion, without communications or data transfers occurring and kept for the time necessary to meet your request. You can exercise the rights of access, rectification or deletion of your data, by writing to arco@antala.uk, for more information, you can consult our Privacy Policy

Request a Quote

Please send us your request to receive a customised offer, either for specific products or special requirements.

TECHNICAL DATA SHEET AND SAFETY DATA SHEET

Please fill in the form to receive the .pdf document.