Experience exceptional heat management with MG Chemicals 8618 Ultra Thermal Grease. Its high thermal conductivity of 6 W/m.K ensures superior heat dissipation, making it the go-to solution for high performance CPUs, LEDs, and power resistors. The unique silicone-free formula offers excellent wetting properties, ensuring perfect conformance to your component’s intricate geometry without the usual bleed and pump-out issues. Its wide operating temperature range is ideal for aggressive thermal cycling conditions. Get ready to maximise efficiency and enhance the durability of your electronic components with MG Chemicals 8618 Ultra Thermal Grease. Don’t wait, power up your circuits immediately with our top-rated thermal paste!
The MG Chemicals 8618 Ultra Thermal Paste is a state-of-the-art, silicone-free thermal grease that provides exceptional heat sink performance. The paste boasts an incredibly high thermal conductivity, ensuring optimal heat dissipation from your electronic components. Its unique thixotropic consistency means it can effortlessly fill the intricate geometry between the component and the heat sink, effectively eliminating common issues such as bleeding and pump out typically associated with other pastes.
Given its impressive properties, the MG Chemicals 8618 Ultra Thermal Paste is incredibly versatile and can be used across a wide range of applications. In particular, it is most often used as a gap filler on heat sinks to CPUs, LEDs, and other electronic components such as thermal sensors, IGBTs, thermal wells and power resistors. Its high thermal conductivity makes it especially ideal for these energy-intensive devices.
What makes this product stand out is its convenience. Once applied, circuits can be powered up immediately, saving valuable time and ensuring your electronics can continue running smoothly.
For applications that require lower thermal conductivity, MG Chemicals offers other products like the 8617A, 8616 and 860. They also have a full range of thermally conductive adhesives for a permanent bond, and thermal gels for tack adhesion when a low modulus material is required.
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