MG Chemicals 8329TFF – Fast Cure Thermally Conductive Adhesive, Flowable

Get the MG Chemicals 8329TFF – Fast Cure Thermoconductive Fluid Adhesive for fast, efficient, and secure bonding. This adhesive is perfect for attaching heatsinks to CPUs, LEDs, and other electronic components. With an exceptional thermal conductivity of 0.8 W/(m·K), it ensures optimal heat transfer while providing excellent electrical insulation. This easy-to-use, syringe-dispensed, flame retardant adhesive offers strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons. Achieve superior tensile and compressive strength with our MG Chemicals 8329TFF. Get your industrial bonding needs covered with this quick-setting, durable epoxy glue. Order now for the best in adhesive solutions.

MG Chemicals 8329TFF – Fast Cure Thermally Conductive Adhesive, Flowable

Product Overview

The MG Chemicals 8329TFF is a high-performance, thermal epoxy glue designed for quick curing. This dynamic adhesive is a 2-part, 1-1 system that efficiently sets in just 15 minutes. Exhibiting the consistency of a smooth off-white paste, this glue cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating.

Recognised for its safety features, the MG Chemicals 8329TFF is UL 94V-0 registered as a flame retardant, ensuring robustness and reliability in various applications. Notably, it demonstrates high adherence to metals, ceramics, glass, and most plastics used in electronic assemblies.

Key Properties

Thermal Conductivity: With a thermal conductivity rate of 0.8 W/(m·K), this adhesive is highly effective in ensuring effective heat transfer between components.
Fast Setting: A 1:1 mix ratio and a set time of 15 minutes make this adhesive perfect for quick applications.
Flame Retardant: This adhesive is UL 94V-0 registered, making it a safe choice for electronics and other applications where fire resistance is essential.
Electrical Insulation: Despite its thermal conductivity, the adhesive provides excellent electrical insulation, further enhancing its suitability for electronic applications.
Durability: The adhesive exhibits high tensile and compressive strength, promising longevity and reliability for bonded components.
Resistance: It has a strong resistance to factors like humidity, salt water, mild bases, and aliphatic hydrocarbons, ensuring a wide range of applicability.

Applications

Commonly used to bond heatsinks to CPUs, the MG Chemicals 8329TFF thermal epoxy glue is a versatile solution for a range of applications. It can also be used to glue heatsinks to LEDs and other electronic components – essentially, any application requiring a fast setting, thermally conductive, electrically insulating adhesive can benefit from this product.

Despite its viscosity, this product is flowable enough to be dispensed from a syringe, making it easy to apply in a variety of situations. The available 50ml size can be used with a mixing tip when dispensing with a caulking gun or pressurised system, offering even more flexibility in its use.

In a nutshell, the MG Chemicals 8329TFF thermal epoxy glue sets the standard for quick-curing, thermally conductive adhesives.