DOWSIL™ Q1-9226 Thermally Conductive Adhesive

Typical applications include bonding organic and ceramic substrates to heat sinks for electronic control modules in automotive applications. It is a two-part, gray, 1:1 mix ratio, heat cure, moderate flow, self-priming, thermally conductive adhesive.

DOWSIL™ Q1-9226 Thermally Conductive Adhesive

Features

Mix ratio: 1 to 1
Accelerated heat cure
Self-priming adhesion to many substrates
Long pot life for ease of use

Applications

DOWSIL™ Q1-9226 Thermally Conductive Adhesive typical applications include bonding organic and ceramic substrates to heat sinks for control modules in automotive applications

Categories Adhesives and Sealants, Electronic Protection Adhesives & Encapsulants, Thermal Interface Materials Brands: DOWSIL - Dow Corning.

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