Dowsil ee-3200

DOWSIL™ TC-2035 Adhesive

Two-part high thermal conductivity adhesive for long term bonds with excellent thermal flow.

DOWSIL™ TC-2035 Adhesive

Features of DOWSIL™ TC-2035 Adhesive

  • High thermal conductivity
  • Adhesion to various substrates
  • Low bond line thickness
  • Stable performance at high temperature (up to 200°C)
  • Excellent thermal performance at various BL
  • Mechanical reliability – maintain stable elastomeric properties after accelerated ageing test
  • Adhesive reliability – adhesion stable or improves after accelerated ageing test
  • Excellent dielectric properties


  • Two-part adhesive


  • Designed to provide long term bonding and efficient thermal flow, especially where low bond line thickness is required to enhance thermal conductivity.
  • Typical applications include bonding organic and ceramic substrates (i.e. PCB, HDI, DBC) to heat sinks for transmission modules, power modules and conversion modules.

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts