Dowsil ee-3200

DOWSIL™ TC-2035 CV Adhesive

DOWSIL™ TC-2035 CV Adhesive is a two-part heat cure silicone thermally conductive adhesive with low bond line thickness and low volatile content.

DOWSIL™ TC-2035 CV Adhesive

Features of DOWSIL™ TC-2035 CV Adhesive

  • High thermal conductivity
  • Primerless Adhesion to the selected substrate
  • Low bond line thickness
  • Stable performance at high temperature (up to 200°C)
  • Excellent thermal performance at various BLT
  • Mechanical reliability – maintain stable elastomeric properties after accelerated aging test
  • Adhesive reliability – adhesion stable or improves after accelerated ageing test
  • Excellent dielectric properties
  • Low volatile content (D4-D10) < 100 ppm (0.01%)


  • High thermal conductivity 3.3 W/m.K
  • Low bond line thickness
  • Easy dispensing
  • Temperature curing at 115°C/15 minutes
  • Primerless adhesion on selected substrates
  • Long-shelf live 12 months at or below 35°C
  • Low volatile content <100ppm


  • Two-part adhesive


  • Designed to provide long term bonding and efficient thermal flow, especially where low bond line thickness is required to enhance thermal conductivity
  • Typical applications include: bonding organic and ceramic substrates (i.e. PCB, HDI, DBC) to heat sinks for transmission modules, power modules and conversion modules
  • Automotive applications: ADAS (Advanced Driver Assistance Systems), ECU assembly, power electronics, converter/inverter, OBC

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts