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Dowsil ee-3200

DOWSIL™ TC-2035 CV Adhesive

DOWSIL™ TC-2035 CV Adhesive is a two-part heat cure silicone thermally conductive adhesive with low bond line thickness and low volatile content.

DOWSIL™ TC-2035 CV Adhesive

Features of DOWSIL™ TC-2035 CV Adhesive

  • High thermal conductivity
  • Primerless Adhesion to the selected substrate
  • Low bond line thickness
  • Stable performance at high temperature (up to 200°C)
  • Excellent thermal performance at various BLT
  • Mechanical reliability – maintain stable elastomeric properties after accelerated aging test
  • Adhesive reliability – adhesion stable or improves after accelerated ageing test
  • Excellent dielectric properties
  • Low volatile content (D4-D10) < 100 ppm (0.01%)


  • High thermal conductivity 3.3 W/m.K
  • Low bond line thickness
  • Easy dispensing
  • Temperature curing at 115°C/15 minutes
  • Primerless adhesion on selected substrates
  • Long-shelf live 12 months at or below 35°C
  • Low volatile content <100ppm


  • Two-part adhesive


  • Designed to provide long term bonding and efficient thermal flow, especially where low bond line thickness is required to enhance thermal conductivity
  • Typical applications include: bonding organic and ceramic substrates (i.e. PCB, HDI, DBC) to heat sinks for transmission modules, power modules and conversion modules
  • Automotive applications: ADAS (Advanced Driver Assistance Systems), ECU assembly, power electronics, converter/inverter, OBC

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