Thermal Silicone Gap Filler, two-part material curing at room temperature.
DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission
control unit. This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.
As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual.
We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers.
Please contact us via phone, website or email.
We wish you the best during this difficult period.