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Dowsil 736

DOWSIL™ TC-4515 Thermal Gap Filler

Thermal Silicone Gap Filler, two-part material curing at room temperature.

DOWSIL™ TC-4515 Thermal Gap Filler

Features & Benefits of DOWSIL™ TC-4515

  • Thermal conductivity: > 1.8 W/m.K
  • Room temperature cure or heat accelerated cure
  • Long term performance stability during temperature cycling up to 150ºC
  • Holds vertical position (cured or uncured state)
  • UL 94 V-0 and CTI ≥ 600 certifications
  • Glass Beads option (180 & 250 micron)
  • Cost-effective fast cure
  • Easy processing
  • Effective assembly

Applications

  • Engine or Transmission control unit
  • Printed Circuit Boards

DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission
control unit. This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.

Regulations & Certifications

  • UL 94 V-0 and CTI ≥ 600 certifications

Please be advised

As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual. 

We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers. 

Please contact us via phone, website or email 

We wish you the best during this difficult period.