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Dowsil 736

DOWSIL™ TC-5021 Thermally Conductive Compound

Grey, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5021 Thermally Conductive Compound

Features & Benefits of DOWSIL™ TC-5021

  • Flowable
  • Non-curing material – no need for curing ovens
  • Capable of achieving thin Bond Line Thickness
  • Low thermal resistance
  • High thermal conductivity
  • Conducts heat away from sensitive PCB system assembly components

Composition

  • Thermally conductive filler
  • Polydimethylsiloxane matrix

Applications

DOWSIL™ TC-5021 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, and notebooks.

Please be advised

As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual. 

We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers. 

Please contact us via phone, website or email 

We wish you the best during this difficult period.