Dowsil 736

DOWSIL™ TC-5121 Thermally Conductive Compound

Greenish yellow, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5121 Thermally Conductive Compound

Features & Benefits of DOWSIL™ TC-5121

  • Optimised polymer matrix to help reduce pump-out
  • Flowable
  • Good thermal conductivity
  • Low thermal resistance
  • Non-curing, no need for curing ovens
  • Heat removal from circuitry components
  • Can achieve thin Bond Line Thickness (BLT)


  • Filled polydimethysiloxane


DOWSIL™ TC-5121 C Thermally Conductive Compound is suitable for use as an interface material for a variety of mid to high-end PCB system assemblies.

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