Dowsil 736

DOWSIL™ TC-5121 Thermally Conductive Compound

Greenish yellow, flowable, non-curing thermally conductive compound.

DOWSIL™ TC-5121 Thermally Conductive Compound

Features & Benefits of DOWSIL™ TC-5121

  • Optimised polymer matrix to help reduce pump-out
  • Flowable
  • Good thermal conductivity
  • Low thermal resistance
  • Non-curing, no need for curing ovens
  • Heat removal from circuitry components
  • Can achieve thin Bond Line Thickness (BLT)


  • Filled polydimethysiloxane


DOWSIL™ TC-5121 C Thermally Conductive Compound is suitable for use as an interface material for a variety of mid to high-end PCB system assemblies.

Please be advised

As COVID-19 continues to impact many industries, companies and their day-to-day processes, we would like to assure you that Antala Ltd is classified as an “Essential Business” and is open for business as usual. 

We have implemented our continuity plan to maximise the safety of our employees while still providing critical support, sales, and fulfilment services to our domestic and international customers. 

Please contact us via phone, website or email 

We wish you the best during this difficult period. 

Request a Quote

Please send us your request to receive a customized offer, either for specific products or special requirements.


Please fill in the form to receive the .pdf document.