DOWSIL™ TC-5550 Thermal Conductive Compound

Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications.

DOWSIL™ TC-5550 Thermal Conductive Compound

Features of DOWSIL™ TC-5550 Thermal Conductive Compound

Good pump-out resistance for bare die application
High thixotropy
One part material
Solvent free formulation
Easy application – screen and stencil printable
High thermal conductivity
Achieves thin bond line thickness (BLT)
Low thermal resistance

Applications

DOWSIL™ TC-5550 Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications

Categories Adhesives and Sealants, Thermal Interface Materials Brands: DOWSIL - Dow Corning.

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