Dowsil ee-3200

DOWSIL™ TC-5550 Thermal Conductive Compound

Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications.

DOWSIL™ TC-5550 Thermal Conductive Compound

Features of DOWSIL™ TC-5550 Thermal Conductive Compound

  • Good pump-out resistance for bare die application
  • High thixotropy
  • One part material
  • Solvent free formulation
  • Easy application – screen and stencil printable
  • High thermal conductivity
  • Achieves thin bond line thickness (BLT)
  • Low thermal resistance

Applications

  • DOWSIL™ TC-5550 Thermal Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and food pump-out resistance especially in bare die applications

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TECHNICAL DATA SHEET AND SAFETY DATA SHEET

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Filling of gaps and trailing edges
Bonding of sensors and current conductors
Repair, fixing of inserts and added elementsof inserts and added elements
Casing repair and bonding
Tooling with high temperature resistance
Union of added elements: Vortex, Serrations, etc.
Bonding of Nacelle
Control Shaft & Components
Protection of Screws & Components for Export
Sealing of Assembled Parts