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MG Chemicals 860 - Silicone Heat Transfer Compound

MG Chemicals 860 – Silicone Heat Transfer Compound

Experience the absolute best in thermal management with MG Chemicals 860 – Silicone Heat Transfer Compound. Engineered to minimise thermal resistance between irregular metal surfaces, this CPU heat sink compound delivers exceptional performance across a broad temperature range of -40 to 200 °C. Its high thermal conductivity of 0.7 W/(m·K) and excellent corrosion resistance make it notable in the market. As a non-electrically conductive and non-bleeding heat transfer paste, it guarantees a long service life, making it a reliable choice for CPUs, GPUs, LEDs, motors, and power components. Trust MG Chemicals 860 for enhanced efficiency, durability, and performance in your industrial systems and equipment. Explore the benefits of this innovative solution today!

MG Chemicals 860 – Silicone Heat Transfer Compound

Discover the MG Chemicals 860 – Silicone Heat Transfer Compound

The MG Chemicals 860 is a top-tier CPU heat sink compound, created to significantly reduce the thermal resistance between irregular metal surfaces. As a thermal paste, it ensures a seamless and efficient heat transfer in your system. Its unique formulation is primarily designed to enhance the flow of heat between the heat sinks and components that generate heat, including CPUs, GPUs, LEDs, motors, and other power components.

Key Features and Properties

The dynamic features of the MG Chemicals 860 make it one of the most reliable thermal pastes available in the market. Here’s a glimpse into its unique properties:

  • Thermal Conductivity: It boasts an impressive thermal conductivity of 0.7 W/(m·K), facilitating efficient heat transfer.
  • High Dielectric Strength: This feature enhances its performance, making it more versatile in its application.
  • Service Temperature Range: The compound is resilient and can operate in a wide service temperature range from -40 to 200 °C (-40 to 392 °F).
  • Corrosion Resistance: The MG Chemicals 860 offers excellent resistance against corrosion, ensuring it lasts longer.
  • Non-Bleeding: As a non-bleeding heat transfer paste, it ensures no leakage or loss of the compound.
  • Non-electrically Conductive: This feature makes it safe for use around electrical and electronic components.

Applications and Uses

The MG Chemicals 860 thermal paste finds its use in a plethora of applications. It has a soft consistency and a reasonable thermal conductivity, making it, in some instances, the best thermal paste for CPU applications. Its excellent performance, versatility and efficiency make it the preferred choice for a variety of purposes.

  • Computers: In personal computers, it is used to improve the heat flow between the CPU and the heat sink, ensuring the CPU doesn’t overheat and maintains optimal performance.
  • LEDs: It can be used to enhance the heat dissipation in LEDs, increasing their lifespan and reliability.
  • Power Components: It can be applied between power components and heat sinks to decrease thermal resistance, thereby improving the performance of the components.

With the MG Chemicals 860, you can be sure of a product that delivers consistent performance and longevity, ensuring your heat-generating components function at their best capacity.

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