Molykote 340 - Heat Dissipation Paste

Properties Molykote 340

• High thermal conductivity
• Low exudation
• Does not flow
• No need for ovens or curing
• Stable at high temperatures

Molykote 340 Applications

• Designed to provide a durable thermal bridge between power elements and heat sinks.
• Typical applications include; thermally conductive connections between transistors, thyristors, and heat sinks.
• It is applied to the base of the heatsinks of transistors, diodes and rectifiers.
• It can also serve as an effective adapter for many heat sinks where effective cooling is required.
• Also suitable for aircraft engines where heat dispensing properties are needed.