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Dowsil 736

DOWSIL™ 1-4174 Thermally Conductive Adhesive

One-part grey, flowable thermally conductive adhesive with high tensile strength and 7 mil glass beads.

DOWSIL™ 1-4174 Thermally Conductive Adhesive

Features & Benefits

  • Flowable
  • Heat cure
  • Same as DOWSIL™ 1-4173 Thermally Conductive Adhesive but with 7 mil glass beads
  • Thermally conductive adhesive
  • High tensile strength
  • No added solvents
  • No mixing of separate components required
  • Glass beads allow uniform, easily controlled bond line thickness
  • Rapid versatile cure processing controlled by temperature
  • Able to flow, fill or self-levelling after dispensing
  • Heat flow away from PCB system components can increase reliability


  • Ceramic filler
  • Silicone polymer

Applications DOWSIL™ 1-4174 Thermally Conductive Adhesive is suitable for:

  • Bonding integrated circuit substrates
  • Adhering lids and housing
  • Base plate attach
  • Heat sink attach

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