THERMAL MANAGEMENT SOLUTIONS FOR ELECTRONICS

Thermal management is a critical issue in the of electronic systems.

As the complexity of the devices continues to grow, designers and manufacturers require improved technologies to effectively remove the generated heat. While fans, heat sinks and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. When it comes to thermal management, industries across the board face a range of challenges, as businesses look for more energy dense and efficient thermal management solutions.

Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling.

Tecnite thermal pads, insulators, compounds, tape and graphite sheets can be used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices and the automotive industry

 


NEW TECNITE THERMAL MANAGEMENT SOLUTIONS FOR ELECTRONICS

A new brochure presenting the complete range is now available.

Since 2015 the Tecnite thermal pads can be promoted at all customers that are in need of a thermal solution for their applications.

First projects were a Tecnite product was specified have been successfully closed, as these Tecnite pads and tapes are performing as good as the well-known 3M and Bergquist tapes, but are significantly cheaper.

The Tecnite thermal pad range has been expanded with some new thermal pads with very high conductivity.

These new thermal pads, called DT40, DT60 and DT70, have a thermal conductivity  of respectively 4, 6  and 7 W/mK.  Apart from these high conductive pads also a new graphite based thermal management product is available.

This very thin graphite sheet, called  DTG5 has an extremely high conductivity and can withstand a very large temperature range of -40 to 400C.

TECNITE THERMAL MANAGEMENT SOLUTIONS BROCHURE FOR ELECTRONICS

THERMAL MANAGEMENT SOLUTIONS


THERMAL PADS

THERMAL MANAGEMENT SOLUTIONS 3

Tecnite pads are constructed from an innovative and advanced silicone rubber with high thermal conductivity and exceptional dielectric strength.

They are available in thicknesses from 0.5 to 12 mm, and this universally applicable material can be used in an unlimited number of thermal management configurations.

The pads provide great conformability, easy application and can be die-cut to fit most applications. They are available as dry pads, or with an optional pressure sensitive adhesive tape for attachment.

Specifications and benefits


THERMAL INSULATORS

Tecnite thermal insulators are extra thin thermally conduc – tive, electrically insulating pads. They are designed for a wide range of applications which require high performance of heat transfer and electrical insulation. These products provide a more consistent breakdown voltage over other insulation constructions.

Specifications and benefits

THERMAL MANAGEMENT SOLUTIONS 1


THERMAL GRAPHITE SHEETS

Tecnite GS is a series of thermal graphite sheets with ultra high thermal conductivity. They combine different important functionalities like high thermal management, light weight, high flexibility, temperature stability with possibility of application on a wide range of substrates and low weight applications.

Specifications and benefits


THERMAL COMPOUNDS

Tecnite thermal compounds are formulated to eliminate pumpout, ensuring long-lasting thermal management and effective heat transfer. They provide high thermal conductivity, minimum bond line thickness and superior surface wetting.

Specifications and benefits

THERMAL MANAGEMENT SOLUTIONS 2


THERMAL TAPE

Tecnite thermal tape offers efficient thermal transfer for a wide range of applications requiring a thermal management solution. The tape combines acrylic adhesive with highly conductive ceramic fillers for an extremely reliable and user-friendly thermal interface. The tape is soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion and act as a good thermal interface.

Specifications and benefits

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